Dr Tim Persoons
Funded Investigator, Ussher Assistant Professor, Dept. of Mechanical & Manufacturing Engineering, Trinity College Dublin
tim.persoons@tcd.ie
01 896 1936


Dr Tim Persoons is Assistant Professor in Engineering in the Department of Mechanical & Manufacturing Engineering at TCD and Affiliate Faculty Member in the Energy Institute at University College Dublin. He is a visiting Faculty member in the NSF I/UCRC Cooling Technologies Research Center (CTRC) at Purdue University, West Lafayette IN, USA since 2009, and was Visiting Assistant Professor in the Department of Mechanical Engineering, KU Leuven, Belgium during 2009-2010. Tim received his Doctorate in Engineering at KU Leuven, Belgium in 2006 and his MSc and BSc in Engineering at KU Leuven in 1999. He was the recipient of a Postdoctoral Research Fellowship from the Irish Research Council in 2008, a Marie Curie Fellowship of the Irish Research Council in 2010 and Senior Research Fellowship in TCD in 2012.

Tim’s current research activities include multi-scale convective heat transfer in electronics thermal management systems using unsteady flows, active flow control for sustainable energy devices, and developing experimental thermo-fluid measurement techniques. He is currently supervising five PhD students and three postdoctoral researchers in TCD, and has graduated two PhD students in the past. Dr Persoons has managed research projects totalling about €1.5 Mio in funding, from a range of sources including Science Foundation Ireland, Enterprise Ireland, Irish Research Council, FP7 Marie Curie Actions, National Science Foundation (USA), Naughton Foundation (University of Notre Dame, USA), IWT Vlaanderen (Belgium), Nokia/Bell Labs and Nokia/Alcatel-Lucent Ireland.

Tim has authored over 100 peer-reviewed journal articles, conference publications, as well as several keynote and invited lectures. His publications have attracted more than 650 citations (h-index 15 on Google Scholar). He is a member of the Therminic scientific committee, a frequent reviewer for leading thermo-fluids journals, has served in editorial roles for ASME Journal of Electronic Packaging (2009-2010) and IEEE Transactions on Components, Packaging & Manufacturing Technology (Special Topics on Data Center Cooling, 2016-2017). He has co-organized a number of technical-scientific workshops (e.g., Therminic 2009, PowerMEMS 2010) and a series of Workshops on Thermal Management in Telecom Systems and Data Centers (2010, 2012, 2015) in collaboration with CTRC at Purdue University. He has received the 2013 Hartnett-Irvine Award from the International Centre for Heat and Mass Transfer.

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Associated ESIPP Work Packages